Fellow TechNetters, Are there any case studies out there that may apply to the following request. Can varying degrees of delamination be identified with CSAM and correlated with x-ray imaging and followed up with destructive cross section analysis. Is it possible to see the above stated artifact on a PCBA with PBGA package. Given: The suspected delamination induced by excessive rework, Thermal Excursion and/or too high Assembly Process Profile. Victor, --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------