We build flex circuits with the following construction - 9 or 18 micron copper on 25 micron kapton. Pitch is either 40 micron, 50 micron or 75 micron. The problem we are having is testing. Presently we use flying probe because of a) the density and b) we are concerned about damaging the copper leads which cannot have large dents in them from a bed of nails. I am interested in any feedback on testing methodologies - newer technologies, better methods or any other feedback. Thank you Steve Kelly PFC Flexible Circuits Limited Ph: (416) 750-8433 Fax: (416) 750-0016 Cell: (416) 577-8433 E-Mail: [log in to unmask] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------