Hi all,

There is a presumption (not supported with data) here that when it rains,
and the humidity goes up, we historically have experienced more solder
defects.  I realize that humidity can affect MSD's and PCB's, but what, if
any, would be the symptom of high humidity, in terms of solder joint
defects at wave and reflow (solder balls,voids)?  Our process is strictly
no-clean.  Normally, the humidity in our plant is 10-30%, and when it is
high, it's in the 50-60% range, which is probably not even that high
compared to some of your plants located in humid climates.  I suspect that
our problem may be something other than the humidity.

Also, we don't bake our PCB's, and I'm not sure if it's necessary.

Howard Watson
SMT Manufacturing Engineer
AMETEK/Dixson

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