Victor, we use high temp solder balls on the 4 corners of a 625 ceramic BGA.
The main purpose is to prevent the device from collapsing, causing solder
bridging.  Maintaining the stand-off height after reflow also increases long
term reliability.

Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879


        -----Original Message-----
        From:   Victor Hernandez [SMTP:[log in to unmask]]
        Sent:   Wednesday, September 24, 2003 8:10 AM
        To:     [log in to unmask]
        Subject:        [TN] 5Sn / 95Pb Solder Sphere
        Importance:     High

        Fellow TechNetters:

           What is your experience with HIGH Temp Solder Sphere (Sn05Pb95).
BGA or Micro Bump.
        What is the primary usage and WHY.
        Is there any Reliability Documentation out there for this
application?

        Victor,

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