Hi Brian and IPC LF Listservers, I am glad you find it hard to believe. If you have ever seen the photos of Tin Whiskers or Silver Migration both are hard to believe. Rather than doing my own search I am still hoping Doug from TI the friend of Abbott from TI, or one of the others from all the company links that Doug kindly gave us, will give us all a link on the web so we can both read and learn. I doubt that the Ag is in the Lead Frame, I would hope that most component manufacturers do not use Silver unless done with lots of understanding or in special situations. Let's take as a playing example Im-Ag as a PCB surface finish and add to it a non wetting situation that doesn't bring in the Ag into the joint. Some metals during the soldering process will migrate to the outside and create a rich region is another option yet I like surface contaminants. Add to this an activated flux that isn't cleaned off the board as well as it should be, add to this a high humidity application. YiEngr, MA/NY DDave -------------------------------------------------------------------------------Leadfee Mail List provided as a service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Leadfree To temporarily stop delivery of Leadree for vacation breaks send: SET Leadfree NOMAIL Search previous postings at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -------------------------------------------------------------------------------