Fellow Techies,
Hopefully, someone can shed some light on my concern about rinsing boards (soldered with water soluble flux) with softened water vs. DI water.
A board assembly house suggested that it is acceptable to do in-process rinsing using "softened" water (in an in-line cleaner) and save the "DI water" rinse for the FINAL in-line cleaning. In-process cleaning would be for example after the 1st side is soldered on a double sided board. Seems like a lot of extra work to me switching from softened to DI water.
Look forward to your comments.
thanks
joe