Leo, It is not my intention to create something else from my clarification of this issue of the pink bubble wrap/bags. I am a novice in ESD and it is not possible for me to read up all books on ESD. As such, I welcome readily available information or discussion. We did not discuss any issues of ESD in the course. I brought up this subject to satisfy my curiousity and thirst for extra inforamtion. I just want to ensure that the ESD control implementation in my dept that we recently setup is correct. If not, how I can help to improve. I want to stress that my instructor did not promote an agenda beyond what is required in the course. Regards, Wee Mei Leo Lambert wrote: >As the author of the IPC-a-600 training program, I'm disturbed that this >kind of information is being delivered throughout the program. There is no >mention of any pink poly material in the instructors guide or in the text >itself. Additional information provided by instructors are what makes the >courses vary from location to location and this can be good and can also be >bad. From my viewpoint this instructor has no idea and it promoting an >agenda which should not be allowed while teaching the course. > >I would take this to the IPC training director and have them get back to the >instructors relative to the additional material they are providing. When the >instructors guide was developed all the analogies were realistic to the >board fabrication process and ESD packaging was never introduced. > >Perhaps a mention on sulfur free paper between the boards as they are being >packaged would be mentioned as to highlight the potential problem of sulfur >contamination on the solderable surface of the board, but non of the ESD >material. > >Bring this up to Jack or John Perry, although they are up to their armpits >in fighting fires, they may be able to shed more light on this matter. > >Leo Lambert >Tech Dir. >EPTAC Corp >71 Route 101 A >Amherst NH 03031 >www.eptac.com >[log in to unmask] > >-----Original Message----- >From: TechNet [mailto:[log in to unmask]]On Behalf Of Brian Ellis >Sent: Wednesday, August 27, 2003 7:36 AM >To: [log in to unmask] >Subject: Re: [TN] ESD Pink Bubble Wrap/Bags > > >I'm unable to give you exact up-to-date information but pink ESD >wrapping materials used to contain substances like adsorbed polyglycols, >with free hydrophilic molecular ends. These would absorb atmospheric >humidity and thus be slightly conductive. The downside is that the >adsorbed substances would desorb and transfer themselves to the >assembly, potentially causing electrical leakage problems. As such, they >were not recommendable. It is even possible, but unlikely to a >significant extent, that they could reduce solderability. > >Having said that, it is probable that improvements have been made to the >materials in the meanwhile and today's are OK, but I cannot be categorical. > >However, what you say about dioxin is not credible: there is no way that >this could happen. > >Brian > >Lum Wee Mei wrote: > > >>Hello, >> >>We recently ordered cushioned ESD bags and a big roll of the pink bubble >>wrap. The pink bubble wrap is used to wrap PWBA that are bigger than >>those ESD bags that we ordered. I have heard that pink bubble bags have >>impact on PWBA even though they are ESD. However, my supplier ensure >>that there is no problem or impacts at all as long as they are ESD coated. >> >>I just came back from the IPC-A-600 Inspector course and was told by my >>instructor that pink bubble bags absorb moisture readily and will age >>the PWBA ESD coated or not as it produce dioxin. This will cause the >>PWBs difficulty in wetting. >> >>I just searched the TechnNet archieves but I am lost in those messages. >>Can someone be kind enough to give me some good reference or advice what >>am I going to do with that big roll of pink bubble wrap? >> >>Thanks and regards, >>Wee Mei >> >>--------------------------------------------------- >>Technet Mail List provided as a free service by IPC using LISTSERV 1.8e >>To unsubscribe, send a message to [log in to unmask] with following text in >>the BODY (NOT the subject field): SIGNOFF Technet >>To temporarily halt or (re-start) delivery of Technet send e-mail to >>[log in to unmask]: SET Technet NOMAIL or (MAIL) >>To receive ONE mailing per day of all the posts: send e-mail to >>[log in to unmask]: SET Technet Digest >>Search the archives of previous posts at: http://listserv.ipc.org/archives >>Please visit IPC web site >>http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional >>information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 >>ext.5315 >>----------------------------------------------------- >> >> >> >> > >--------------------------------------------------- >Technet Mail List provided as a free service by IPC using LISTSERV 1.8e >To unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet >To temporarily halt or (re-start) delivery of Technet send e-mail to >[log in to unmask]: SET Technet NOMAIL or (MAIL) >To receive ONE mailing per day of all the posts: send e-mail to >[log in to unmask]: SET Technet Digest >Search the archives of previous posts at: http://listserv.ipc.org/archives >Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 >for additional information, or contact Keach Sasamori at [log in to unmask] or >847-509-9700 ext.5315 >----------------------------------------------------- > >--------------------------------------------------- >Technet Mail List provided as a free service by IPC using LISTSERV 1.8e >To unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet >To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) >To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest >Search the archives of previous posts at: http://listserv.ipc.org/archives >Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 >----------------------------------------------------- > > --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------