Technet, I have come across a rash of failed assemblies that have 0805 capacitors and resistors, bottom side glued, wave soldered and washed. Trouble shooter reported touching up the solder joints on a few areas and the boards would pass test. I had a look at one board which was reported to have a 0805 56K resistor with "drifting" values. I pulled the component off mechanically in order not to apply any heat and noticed several mini-voids within the adhesive body. I have seen solder bridge within the glue before but this was the first time I saw wet residue within the voids. You can view a sample image from Steve's web site: http://www.stevezeva.homestead.com/files/SMTAdhesive.jpg The image showed the bottom side of the cracked resistor after removal (white), with a portion of solder mask (green) and SMT adhesive (red). I used a 8mil stencil. The thermal profile was verified and conformed to the slope/ curing specs. Has anyone seen this before? Any explanation as to how the void was formed and how moisture got tapped in? Does anyone re-use their glue on the line or throw away any left-over to avoid moisture in the glue? Rgds, Peter --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------