Larry, While back ago, we had the same issue with a similar crystal. We were able to eliminate the problem by reducing the apertures a great deal, 50%. The paste is indeed getting squeezed under the component and forming a small solder bead during reflow. You might want to check the placement height and force, that could also be a contributing factor. I agree with you, sometimes component manufacturers don't know very much of the process, and make erroneous recommendations. The other option, I did try it in a S016 with a heat slug, is to modify the rectangular pad with a series of spaced round apertures, this way the flux/paste have somewhere to go during reflow. My grain of salt Jorge Rodriguez Process Engineer Varian, Inc [log in to unmask] -----Original Message----- From: Larry Koens [mailto:[log in to unmask]] Sent: Thursday, August 07, 2003 1:18 PM To: [log in to unmask] Subject: [SP: 43%] [TN] solderballs from components with zero standoff Techneters Steve was good enough to post a picture of my problem on his website. It's titled "solderball beside crystal." This crystal has two Castellated terminations at each end of the component. These two terminations are tied together underneath the component. Our pads and paste are per the manufacture's suggestions (not that is always a good thing)But as you can see, we have a solderball problem. My feeling this that the paste is getting squeezed out under the component and forming the solderballs. What type of paste aperture reductions do you all use for this type of component that really doesn't have any standoff height? I know most companies use a standard 10% reduction. Just not sure if it's enough. thanks, Larry Koens E.I. Microcircuits --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------