Thanks for the advice, Werner. I didn't realize this document existed. The original recipe was determined by running a thermocoupled assembly through the oven and matching the time/temperature graph supplied by the paste manufacturer. When the manufacturer made adjustments to the recipe, it was done with the aid of a Super MOLE. Thank you, Paul Black Manufacturing Engineer Kronos -----Original Message----- From: [log in to unmask] [mailto:[log in to unmask]] Sent: Friday, August 22, 2003 7:49 AM To: [log in to unmask]; [log in to unmask] Subject: Re: [TN] Soft solder Hi Paul, Are you profiling your assemblies to determine a proper oven recipe? Look ay IPC-7530. Just calling in your paste supplier is in many cases not sufficient. Regards, Werner Engelmaier Engelmaier Associates, L.C. Electronic Packaging, Interconnection and Reliability Consulting 7 Jasmine Run Ormond Beach, FL 32174 USA Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904 E-mail: [log in to unmask], Website: www.engelmaier.com --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------