Hi Guenter, and IPC-LF Listservers, In the Solder Joint Reliability tread Jean noted he has read that SnAgCu (SAC) can have a higher creep rate than SnPb (Sn63Pb37), or as I have sometimes seen in EU notes 63Sn37Pb, at higher stress levels. I am a bit doubtful that we could see SnPb being higher in creep rate at lower stresses and then SAC all of a sudden becoming higher. My only thought is that the researchers made some mistake like comparing pre-yield point SnAgCu to post-yield point SnPb. SO What do you think about this report that showed at higher stresses that SnAgCu had a higher creep rate than SnPb. YiEngr, MA/NY DDave -------------------------------------------------------------------------------Leadfee Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Leadfree To temporarily stop delivery of Leadree for vacation breaks send: SET Leadfree NOMAIL Search previous postings at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -------------------------------------------------------------------------------