Hi Guenter, and IPC-LF Listservers,

In the Solder Joint Reliability tread Jean noted he has read that
SnAgCu (SAC) can have a higher creep rate than SnPb (Sn63Pb37),
or as I have sometimes seen in EU notes 63Sn37Pb, at higher stress
levels. I am a bit doubtful that we could see SnPb being higher in
creep rate at lower stresses and then SAC all of a sudden becoming
higher. My only thought is that the researchers made some mistake
like comparing pre-yield point SnAgCu to post-yield point SnPb.

SO

What do you think about this report that showed at higher stresses
that SnAgCu had a higher creep rate than SnPb.

YiEngr, MA/NY DDave

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