We're starting to
see more of the newer leadless packages (QFN, LCC, MLF, etc.) and are finding
that we get some voiding when running these. Does anyone have information on the
amount of voiding that is acceptable on this type of package or can point me at
sources for this information?
Thanks in
advance,
Rick Thompson
Sr. SMT Process Engineer
SMTEK International, Inc.
+1 (805) 532-2800
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