We're starting to see more of the newer leadless packages (QFN, LCC, MLF, etc.) and are finding that we get some voiding when running these. Does anyone have information on the amount of voiding that is acceptable on this type of package or can point me at sources for this information? Thanks in advance, Rick Thompson Sr. SMT Process Engineer SMTEK International, Inc. +1 (805) 532-2800 [log in to unmask] --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------