Hello All

What are your recommendations regarding land pattern design for a Fine-
Pitch Ball grid Array (FBGA) 12*11 mm
0.8 mm (31,8 mil) pitch, 0.3 mm (12mil) ball diameter.
We use at the moment a 12 mil land pattern and 12 mil stencil opening (6
mill thick).
My main concerns are because of voiding in the solder joint.

Any comments welcome

Siggi

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