Is there a specification for the % phosphorous in the nickel deposit for electroless Nickel/Immersion Gold for surface mount pads on PWBs? We are seeing as high as 14% and are also seeing solder joint failures at the nickel interface on BGAs w/18mil balls. Is there an industry standard for phosphorous content? If there is no industry standard, any ideas of what the spec should be? Thank you. Best Regards, Mike Forrester LeCroy Corp. --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------