Another interesting article regarding copper-filling microvias. http://www.enthone-omi.com/electronics/pdf/CAApril03CooksonCopperFill.pdf Jason Gregory SMT Production Supervisor/ Integrated Product Team Leader LaBarge Inc. (918)459-2367 (918)459-2221 fax [log in to unmask] http://www.labarge.com Carlr Ray <Carlr.Ray@SANMIN To: [log in to unmask] A-SCI.COM> cc: Sent by: TechNet Subject: [TN] BGA Viods <TechNet@listserv .ipc.org> 07/02/2003 10:18 AM Please respond to "TechNet E-Mail Forum."; Please respond to Carlr Ray Hello All, I have a question (more like a poll I guess), concerning voiding of BGA devices. I have PBGA 480 IO paremeter grid device and I am seeing lots of voiding. Per the x-ray I am well within the IPC spec of 35% but I am still having failures at ICT (OPENS). Once I reviewed the profile I noticed we were not hitting the dewell time for flux activiation recommended by the solder paste vender (min 60 seconds) and we were seeing an extended time above 183c. We have changed the profile but some of my companions feel that the size of the pad and amount of solder paste is effecting the voiding. I disagree with them and feel that not activiating the fluxes and extended time above liquidous is a major contibutor to the voids. So now my question, what impact does the pads have with the voiding of the spheres on the BGA? Carl Ray Sr. Manufacturing Engineer Huntsville, AL 35807 Phone: 256-882-4800 ext. 8845 Cell: 256-990-1990 --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------