Having formulated a number of UV curable solder masks in previous years, I do know that the IPC used to have a specs that required exposure to solvents, including methylene chloride. With UV's, more cure equals a higher crosslink density...and hence....better resistance to solvents (and flux absorption). There is instrumentation to help characterize cure, but it is not straight forward for the average user. Thermal cure chemistries generally give (gave) better performance than UV's since many UV's use smaller chain epoxy acrylate monomers (diluents) that just don't offer as much bond strength as polymers with BPA resins. -----Original Message----- From: Leigh Jansen [mailto:[log in to unmask]] Sent: Monday, July 14, 2003 12:55 PM To: [log in to unmask] Subject: [TN] SOLDER RESIST COMPATIBILITY Importance: High Dear All, can anyone kindly quote me any specific standards which relate to either the degree of cure of solder resists (I know of a BS standard which uses 3 different solvent rubs but can't remember the number..) or, which relate to the compatibility of the resist with coating strippers ?? As I am not an expert in solder resists but generally I thought they were epoxy based and if cured properly, pretty resistant to even the likes of Methylene Chloride ? Many thanks in advance, Leigh Jansen Technical Support Manager Concoat Limited - Engineering Electronics Reliability Web: www.concoat.co.uk AND www.concoatsystems.com --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------