RE: [TN] PICTURES: Wave solder process gone bad

From looking at your pictures it maybe the case that your PCB supplier did not apply a sufficient amount of Gold on the boards and what you are trying to do is solder to the nickel base metal below.

Regular tin-lead solder does not wet to nickel.
You may be able to prove this by having an XRF analysis done to a bare board.  That should be able to provide you with how thick the Gold has applied to the base metal.

Mark Krmpotich
DFx Engineer
World Wide Operations Technology
Scientific Atlanta
Tel: 770-236-5166
Fax: 770-236-4707
mailto:[log in to unmask]
http://www.scientificatlanta.com/


-----Original Message-----
From: Frank L Norman [mailto:[log in to unmask]]
Sent: Tuesday, July 29, 2003 10:37 AM
To: [log in to unmask]
Subject: [TN] PICTURES: Wave solder process gone bad


Technet,

PWA's experienced solder wetting difficulties to plated through holes
including via's during the wave solder process. PWA's are two sided
multilayer finished with Electroless Nickel Immersion Gold (ENIG). Top
side SMT components were reflowed and bottom side SMT and through hole
components were wave soldered.

SEE PICTURES of bottom side of PWA at this website.

http://www.ripus.com/images/pwa/index.htm

Does anyone know what may have caused this issue?

Regards,
Frank Norman
Manufacturing Support Engineer
Raytheon, Space and Airborne Systems (SAS)
(805)879-2745
[log in to unmask]

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