loctite may have some data on this.


Michael Weekes
Master Engineer - EOE
Hamilton Sundstrand / UTC
MS 190-6
4747 Harrison Ave. PO Box 7002
Rockford, IL 61125-7002
815 394 3362
[log in to unmask]

-----Original Message-----
From: Stephen Ayotte [mailto:[log in to unmask]]
Sent: Friday, July 11, 2003 8:28 AM
To: [log in to unmask]
Subject: [TN] Underfilling BGA components



Does anybody have data and experience with the improvement or degradation in
reliability by underfilling a cavity down, 1 mm BGA pitch, PBGA package?
The PCB thickness in this situation would be greater than 0.110.

Thanks.

Stephen Ayotte, IMD Manufacturing Quality Senior Engineer
Dept. N62V, Bldg. 966-2, Office 2J1309,   Mail Drop 967A

Phone (802) 769-4775,    t/l 446-4775,  Fax (802) 769-4139
Pager (802) 878-5386 Pin #4685 - external,    74685 - internal
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