Technet, We have been using IPA to clean SMT adhesive off the stencil during the build and ultrasonic wash after the build. Over time we started noticing residues of adhesive around the inside walls of the stencil appertures. The adhesive appeared to be cured and hardened and we tried many ways but were unsuccessful in removing it (brush with more aggressive solvent, ultrasonic clean etc.) We were informed that a specific proprietary cleaner solvent has to be used to clean the adhesive off the stencil effectively. The down side is a 5X cost compared to IPA and a 2-5 times slower evaporation rate. Does anyone have similar experience with cleaning SMT adhesive off the stencil? What is the common cleaning interval applied during adhesive printing? (we clean every 5 prints) Any suggestion in methods to recondition the stencil appertures? Rgds, Peter --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------