Hi All!
I'm going to reject these fabs, even though they're built-up, and even though they're proto-types...we're going to have to build four more assemblies quickly, with good fabs, and try to explain the delay to our customer...fun stuff huh?
There's just been too many responses that have said what I have isn't good...
I really appreciate everybody's input!!! What was I thinking when I talked about unsubscribing? Silly me!!!
Thanks everyone!!!
-Steve Gregory-
Does anyone except me and Joe Feldstadt remember why we use weight instead of thickness in measuring Copper??
Copper foil used in making printed circuit boards is created by electroplating directly on to a roll, and peeled off as it is formed, thus it never sees a roller. This plating process produces the surface we are all used to seeing on the roll side, but on the plating solution side, the surface is very rough and uneven. This roughness makes it nearly impossible to measure the thickness, as it is different where ever you measure it. So, we use weight, which gives us an average thickness....1 ounce/square foot = 1.3 mils = 1300 microinches.
Seems a good way to get around the roughness issue...
Anybody got an alternate?
Rudy Sedlak
RD Chemical Company
-Steve Gregory-
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