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I have to think it's as simple as, they have an electroplate line and not an ENIG line. From experience, it's almost impossible to control the electroplate gold in the thickness (thinness) range to "replace" ENIG. I'd say your statement below speaks volumes "We have not had any issues with our current assemblies using [ENIG] ".
-----Original Message-----
From: Scott Lefebvre [mailto:[log in to unmask]]
Sent: Tuesday, June 24, 2003 1:52 PM
To: [log in to unmask]
Subject: [TN] Electro-Plated Ni/Pd/Au vs [ENIG]

I have a new board shop promoting their Electro-Plated Ni/Pd/Au (hard or soft gold) surface finish over our existing [ENIG] boards.  We have not had any issues with our current assemblies using [ENIG].  I am requesting any advice or information on Electro-Plated Ni/Pd/Au and if it would be worth switching to it.  Any advice would be greatly appreciated, thank you in advance.

 

SCOTT

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