Hi,

Appreciate if anyone could share their experience on using 24 mils thick (4 layer boards) with lead free solderpaste (Sn/Ag/Cu alloy)? How do you control warpage in the temperature profile?

Does grain direction or how glass cloth is laid in pre-preg helps to minimise warpage? Does more copper plating over copper core helps to minimise warp?


Thanks in advance.

Best regards,
David.


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