Good insight Werner, We've discussed the same principle with Palladium finishes. Personally, I'm an advocate for extended time at common process temperature rather than increased temperature and the possible impact for products and materials. This approach does impact throughput to a minor extent. Mel Parrish Director, Training Materials and Resources Soldering Technology International 102 Tribble Drive Madison, AL 35758 256 705 5530 256 705 5538 Fax [log in to unmask] www.solderingtech.com -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Werner Engelmaier Sent: Tuesday, June 17, 2003 10:49 PM To: [log in to unmask] Subject: Re: [TN] ENIG questions Hi Poh, Sure can. Ni disolves in Sn at a rate 40-times slower than Cu [see Klein Wassink, Soldering in Electronics]; therefore you need much more thermal energy to form a good metallurgical bond. For more detail, you may also check my reliability columns in Global SMT & Packaging magazine, particularly "Soldering: Quality & Reliability Issues," August 2001, and "Solder Joint Formation & Intermetallic Compounds (IMCs)," April 2003. Regards, Werner Engelmaier Engelmaier Associates, L.C. Electronic Packaging, Interconnection and Reliability Consulting 7 Jasmine Run Ormond Beach, FL 32174 USA Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904 E-mail: [log in to unmask], Website: www.engelmaier.com In a message dated 06/17/2003 12:02:14, [log in to unmask] writes: >Hi Werner, >Can you explain the reason for raising the peak reflow temperature by 15 >to 20C when soldering to Ni ? >Poh --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------