Hi Bev!
The minimum vertical hole fill is defined as follows:
Class 1: Not specified, with a 270-degree circumferential fillet and wetting on the secondary (solder source side) of lead and barrel, and a 75% coverage of the land area on the secondary side.
Class 2: 75% fill, with a 270-degree circumferential fillet and wetting on the secondary (solder source side) of lead and barrel, and a 75% coverage of the land area on the secondary side.
Class 3: 75% fill,ith a 330-degree circumferential fillet and wetting on the secondary (solder source side) of lead and barrel, and a 75% coverage of the land area on the secondary side.
You can go down to a 50% vertical fill, with 360-degree fill around the lead with 100% wetting from the barrel to the lead on the solder source side, for class 1 & 2, but not for class 3...and that's when there are thermal planes connected to the barrel and act as heat sinks.
Then there's the statement in certain situations, less than 100% may not be acceptable.
No "there was a relaxation of solder fill when and if the lead of the component was not sufficiently large enough compared to the PTH to which it was soldered". statement anywhere in the -610 that I can read...
-Steve Gregory-
Technetters,
Someone in our company is quite sure "there was a relaxation of solder fill when and if the lead of the component was not sufficiently large enough compared to the PTH to which it was soldered". I have no recollection of such a change in A610. But the maybe some of my brain cells are on vacation. Can anyone comment on the statement about hole fill, please? Thanks.
Bev Christian
Research in Motion
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