For those of you doing solderability testing, what sorts of parameters should we be concerned about for reliable results? Our tester already allows inputs for lead perimeter, cross sectional area, and hang time. My company's testing also specifies immersion angle, depth, and speed as well as the type of flux. By controlling these factors, can I expect repeatable results? It has been suggested that we also need to limit the length of the leads for our testing as wall as installing a thermal break between the lead and the hanger. Both have been blamed for failing test results. Has anyone experienced changes in test results from these variables? Neil Flatter TRW-Automotive Process Quality --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------