hi,
 
i agree with tony.  but...possibly the mask that inhibited the pattern plating in this area got embeded in the subsequent pattern plating and didn't wash off prior to etching the board.
 
by the way, the etching around the land patterns looks very raggedy.
 
phil

-----Original Message-----
From: Tony Steinke [mailto:[log in to unmask]]
Sent: Wednesday, May 28, 2003 12:12 PM
To: [log in to unmask]
Subject: Re: [TN] Trace thickness problem...


Steve,
It appears that the only copper remaining at the reduced area is the copper foil-which if your supplier started with 1 ounce foil that is what the thickness is in the particular area.
It looks to me that something prevented the electrolytic copper from plating but it was detected before etching
and "touched-up" prior to etching.(Do you know if your supplier does pattern or panel plating?) I don't think electrically it will cause a problem unless it is high current net.
 
Tony
----- Original Message ----- 

From: Steve Gregory <mailto:[log in to unmask]>  
To: [log in to unmask] 
Sent: Wednesday, May 28, 2003 1:53 PM
Subject: [TN] Trace thickness problem...

Hi all!

I'd like your opinion on something. We're building a prototype assembly for a customer, and discovered something at final inspection that we didn't see when we received the bare fabs. We ordered 16-boards in four, 4-up panels. 

We found a trace that has a spot where it looks like it didn't plate up during final plating. Take a look at "Trace Thickness" at http://www.stevezeva.homestead.com 

There's 4-boards we've found that have this problem, 1 on one panel, and 3 on another panel, and of course they're all built up. The 6012 says that thickness can't be reduced by more than 20% of the minimum conductor thickness. I can't really tell if it's 20% or 50%.

I've sent pictures both to our customer and the fab vendor. The customer wants the spot repaired, and there are a number of ways to do that. The fab vendor says it's not a problem because the stack-up drawing calls out 1-oz. copper after plating on the surface layer, and they said that there's more like 2-oz. on the surface layer, so there shouldn't be any problem, at least that's what I was told, I didn't speak to anyone directly. The stack-up is on my page too, look at "Stack-up"...

The first question that comes to my mind, if 1-oz after plating was called on the stack-up, why was 2-oz plated? Or is that normal?. The drawing references our customers internal spec for fabrication, but it uses MIL-PRF-55110 for references.

What are your opinions about this?

Thanks everyone!

-Steve Gregory-

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