Colleagues,

It is time to raise some eyebrows at the IPC’s 2003 Annual Meeting and Technical Conference, September 28 – October 2 in Minneapolis, MN.  This year, demonstrate to your peers how to slash lead times, improve quality, increase production capacity and above all, innovate in a tough economic climate. This year’s technical theme “Exotic Interconnections and Advanced Process Capability”, will consist of a variety of paper presentations, panel discussions and educational courses on how to reach these difficult goals.  Subjects include:

·        Exotic Interconnections including

o     Via Protection Concepts

o     Exotic Substrates

o     Multi-chip System in Package (SiP) and folded/stacked Die CSP

·        Advancing Process Capability through Statistical Benchmarking

·        Latest Data Reports on Immersion Finishes for PCBs

·        Laser Processing

·        High Frequency Circuit Design and Materials

·        Advances in AOI/AXI Inspection Technology

·        The Latest in Embedded Passives

·        Assembly Advances and Challenges

Interested in sharing your expertise?   By participating in IPC’s 2003 Annual Meeting and Technical Conference, you and your company will gain great visibility among industry leaders who then use your research and findings when they develop standards and guidelines.  There’s still time to sign up to present a  30 minute paper.  The deadline for abstract proposals is May 23, 2003.   You can submit your information online quickly and easily through the link provided below.    And, presenters receive FREE conference admission on the day of their presentation.  Contact [log in to unmask] for more information.

Go to  www.ipc.org/annual now.   You’ll see the latest hotel/travel and updated meeting information.  You can even register online.