In a message dated 5/21/03 5:03:38 PM Central Daylight Time, [log in to unmask] writes:

Phil,

I believe what the question refers to is the nickel/tin alloy which some people call the Santaclara process. This was developed several years ago for the telecommunications industry to minimize corrosion. However, it is not a very reliable surface to solder to and was abandoned by most users.

Larry

hi,

I think, but am not certain, that I understand your question.

First of all, I interpret nickel/tin plating to be 'pure' nickel with 'pure' tin deposited on top of it. If this is the case, you haven't gotten rid of the magnetic nickel.

second, nickel-only is not a good finish to solder to say the least

third, specifically, what do you mean by reliability?

Phil

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