Dear Madam / Sir, We do not consider this to be an advertisement - but if you do, please delete before going further. This is a news about an alternative process and if you desire to know more about it regarding Copper, Electroless simplified process, Peel strength, Thermal dissipation, simplified SBU, even new Direct Structuring capabilities, with new Polyimide (not on the market as of today, but samples available) or regular epoxy resins, even Solder Mask with simplified electroless capabilities and Thermal dissipation.. there is an alternative called "Cu2O Deposition Process" - a presentation is available on the below website. Very Best Regards - Roland www.PCBspecialist.com Roland Jaquet - PCBspecialist - 14 ch. de Vers - CH-1228 Plan-Les-Ouates - Geneva - Switzerland - T +41-22-880-0405 - F +41-22-880-0409 - GSM +41-79-203-3723 - Company & Technical Viability - Yield Improvement - Company Strategy & Acquisition - Equipment & Technology Choice - EIPC Member ----- Message d'origine ----- De : Larry Russell A : [log in to unmask] Envoye : jeudi, 29. mai 2003 05:28 Objet : [TN] FW: formula lead to peeling strength of pad on finished PCB > Dear sir/lady: > > Is there any formula available for peeling strength calculation of any kinds of pads on finished PCB? > there is formula for that of laminate materials or land stated in IPC TM-650, but not for pads on finished board, At your convenience, we would like to have your offered information. Thanks! Have a nice day! > Best Regards > > > Jack Low > > E-MAIL: [log in to unmask] > --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------