In a message dated 5/21/03 5:03:38 PM Central Daylight Time, [log in to unmask] writes: Phil, I believe what the question refers to is the nickel/tin alloy which some people call the Santaclara process. This was developed several years ago for the telecommunications industry to minimize corrosion. However, it is not a very reliable surface to solder to and was abandoned by most users. Larry > hi, > > I think, but am not certain, that I understand your question. > > First of all, I interpret nickel/tin plating to be 'pure' nickel with 'pure' > tin deposited on top of it. If this is the case, you haven't gotten rid of > the magnetic nickel. > > second, nickel-only is not a good finish to solder to say the least > > third, specifically, what do you mean by reliability? > > Phil > > --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------