Hi Werner and All
Just finished evaluating a lot of boards that had gross inner layer
separation - not just on layer 2 and n-1, but all layers in "as received"
microsections.  Subsequent to Thermal Stress testing the number of occurances
increased.  A second lot from the same mfgr. had only one panel with
separation "as received", but all opened after Thermal Stress.

I'm not certain what your comment regarding board mfgrs not being able to
produce boards that exhibit inner layer separation.  My experience is that
they can do this in many different ways.  Some show up before Thermal Stress
testing and others after.

Susan Mansilla
Robisan Lab

---------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------