Trying to get some feedback. We been using a couple of ORL0 no-cleans and to date the customers have had us cleaning them. A new customer wants us to go no-clean. Being on a short fuse, they didn't want to run a full blown S&IR and electromigration but a ROSE test with an acceptance value of 10 micrograms/sq inch. Vendor A's no clean have me an Omegameter reading of 60 micrograms/sq in after running thru a simulated wave solder process using foam flux application and Vendor B's no clean produce a value of 9.7 micrograms/sq in. (using the identical process). This picqued my curosity so I took some copper clad laminate and cleaned it , oxidized it and applied both fluxes to the topside and heated the panel to 250 F. Both produced some green oxide (I assume cupric oxide since both fluxes should be halide free) with Vendor A producing a dense green layer almost immediately. Haven't run an electromigration test yet but this doesn't leave me with a real warm and fuzzy- at least with Vendor A's flux. Is it reasonable to expect copper corrosion with a flux that passes S&IR and electromigration testing. Commments? --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------