Never heard of it, but understand it could happen. We use Mini Flash
also, but a socket installation. The flash is installed after the BGA
Verify is performed.
Randy Bock Sr.
Quality Manager
GMS Naugatuck
203 729-5370 Ext 239
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Eric Castonguay <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
05/29/2003 08:03 AM
Please respond to "TechNet E-Mail Forum."; Please respond to Eric
Castonguay
To: [log in to unmask]
cc:
Subject: [TN] X-ray beam damaging flash memories
Hi guys,
Never heard about this one in 4 years in the telecom industry. Our current
supplier of flash memories found a very interesting reason why we are
having problems with their parts. The strength of X-ray being used by the
CM on our cards for 5-dx analysis is too strong, they said. Industry
standard is 1K rad max I was told. Going above it causes issues with the
analog section of the programming in the die.
There were able to tweak the registers & re-test them and had no problems
with the chips. They also tried re-exposing them and suceeded in
repeating
the problem. I asked if we could do anything to fix boards that have
already been x-rayed and they said that this cannot be done once the parts
are assembled on the boards.
Considering that Flash is not the only component with an analog section in
it, I think that it would be a good idea to investigate the x-ray
equipment, strength & techniques at our CM, even if they use a standard
Agilent 5DX machine. But first I want to hear if some of you ever met this
problem before.
Thanks.
Eric
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