Looks like to me the track was damaged
during fabrication. May have to do a track repair/replacement. The
Spacing
sure looks like it is connected to the
bottom. (May be a shadow) I have seen broken traces before and had
to repair them. The repair also depends on the board function. Would
check with the customer on their needs.
I am sure someone will have a bit more
info..
Randy Bock Sr.
Quality Manager
GMS Naugatuck
203 729-5370 Ext 239 [log in to unmask]
I'd like your opinion on something. We're building a prototype assembly
for a customer, and discovered something at final inspection that we didn't
see when we received the bare fabs. We ordered 16-boards in four, 4-up
panels.
We found a trace that has a spot where it looks like it didn't plate up
during final plating. Take a look at "Trace Thickness" at http://www.stevezeva.homestead.com
There's 4-boards we've found that have this problem, 1 on one panel, and
3 on another panel, and of course they're all built up. The 6012 says that
thickness can't be reduced by more than 20% of the minimum conductor thickness.
I can't really tell if it's 20% or 50%.
I've sent pictures both to our customer and the fab vendor. The customer
wants the spot repaired, and there are a number of ways to do that. The
fab vendor says it's not a problem because the stack-up drawing calls out
1-oz. copper after plating on the surface layer, and they said that there's
more like 2-oz. on the surface layer, so there shouldn't be any problem,
at least that's what I was told, I didn't speak to anyone directly. The
stack-up is on my page too, look at "Stack-up"...
The first question that comes to my mind, if 1-oz after plating was called
on the stack-up, why was 2-oz plated? Or is that normal?. The drawing references
our customers internal spec for fabrication, but it uses MIL-PRF-55110
for references.
What are your opinions about this?
Thanks everyone!
-Steve Gregory-
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