We have several designs in prototype that we have been experimenting with Immersion Silver. Good results as far as assembly goes, but I just got into a discussion with the In-Circuit Test guy, and he is worried. He is used to having a nice soft mound of HASL solder to press his probes into (woo!), and now we are taking that away. After two reflows I'm not even sure if there is any silver left, are we giving him hard flat bare copper for contact surface? Have any of you had problems probing vias with no solder on them? The same for OSP, I haven't heard of ICT problems once that coating is gone and you have exposed copper. Should we paste our vias and test points with a modified screen? (Seemed like an easy solution to me, but our process guy looked at me like I was crazy). So, do we have a problem or do we just need another type of probe tip or something? All comments gratefully appreciated... Jack --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------