Steve, As Dave Chapman alluded to, is your inspector concerned with reflowed solderpaste on non-pops? Same issue (given her criteria), is it not? > -----Original Message----- > From: Steve Gregory [SMTP:[log in to unmask]] > Sent: Wednesday, May 14, 2003 12:28 PM > To: [log in to unmask] > Subject: [TN] Adhesive where no component is loaded... > > Hi All! > > The fun never ends... > > I've been involved in a rather heated (albeit silly, I think...) debate > with an inspector here, about adhesive being deposited where there is no > component loaded. > > As you may surmise from my posts over the past few days, I stencil epoxy, > not dispense. For some reason, the issue has come up with one of my > inspectors here, requesting that I get something in writing from our > customer saying that it's okay to have epoxy deposits at locations where > there is no component loaded. I told her that I wasn't going to do it > because I didn't want to look silly asking our customer if it was okay to > have a glue dot at a location that's not loaded. > > Her reasoning is that we're putting something on the board that's not > being called out on the bill of material. My response is that the epoxy > isn't called out anyway, but we have to use it to be able to process this > board that has PTH and SMT on the bottom. "But there's no component there, > so there shouldn't be any glue there." was her response. "But it doesn't > make any difference, it's a non-issue" I calmly replied. > > We've been debating this for 2-days now, and I'm about at my wits end. > There's nothing in the -610 or the J-STD-001 that says it's defect, or > that it's forbidden to deposit epoxy where a component isn't loaded, and > there's nothing in the documentation from our customer to keep the unused > areas free from epoxy. I've already spent much more time on this issue > than I ever thought I would. Why this issue has popped-up now, I don't > have a clue. Me thinks it's much ado about nothing. > > What is your take on this issue? > > -Steve Gregory- > --------------------------------------------------- > Technet Mail List provided as a free service by IPC using LISTSERV 1.8e > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/html/forum.htm for additional > information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 > ext.5315 > ----------------------------------------------------- > --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------