Hi All who have responded to this issue and thank you, The configuration of pads is for a SIM CARD, the assembly is a Class 2 product, with three pads on opposite sides, L and W 3.3X1.3 mmxmm (130 milsx50mils), pitch is 2.54 mm (100mils). The connections are not the subject to high currents or voltages, CMOS circuits; the principal function is for mechanical sustaining. The coating is 1R32A from HumiSeal and the thickness is about 30 to 50 micro (~ 1mil to 2 mils). After hand soldering I remove the residues with a hard brush and I repair the coating with a fresh one by brushing. Gusti --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------