----- Original Message -----
Sent: Thursday, April 10, 2003 1:04
PM
Subject: Re: [TN] Stacked DRAM
Try DPAC Technologies
They are a DRAM stacking technology that is used by the
majority of the DRAM suppliers.
I worked for them several years ago.
Ask to speak to Andy Ross
Good Luck
Mark A. Roslawski
Vice President of Marketing
----- Original Message -----
Sent: Wednesday, April 09, 2003 3:11
PM
Subject: [TN] Stacked DRAM
All,
Does anyone have
experience working with stacked DRAM?
We have been
running into issues when reworking these part types.
From what I'm
told, there are many types of stacks out there - and my
organization is currently purchasing/building with both value stacks
and performance stacks. The differences between the two types of
components lies within their construction: the performance stacks have a
film between the two components and the value stacks have a small connecting
device along the lead edges, with minimal coating between the two
DRAM.
When using our
fairly basic rework equipment (AAT Hot Air Machines, Haako hot air pencil,
Metcal iron), we run into DRAM issues when reworking the value parts - no
issues with the performance. We have already contacted the DRAM
manufacturer to verify whether or not they could recommend rework equipment
more suitable to dealing with these parts... The manufacturer
recommended a shovel iron tip, reflowing one side at a time, until
lifted. Well, this works very well - when one has the real-estate to
perform such a repair... but I'm dealing with minimal part spacing on
our PCBs - and using a shovel tip is not possible.
Any
ideas?
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