[log in to unmask]" rel=File-List>
Kevin,
 
I'm not the SMT guy that most people on this forum are but ....
 
I would feel uncomfortable leaving a big fat Hersey's kiss of conductive adhesive under your device....if you could pile it that high.  A large, thick, section of conductive adhesives (at least the ones I have used for [bare] die attach) will usually 'mud-crack' .  The conductive adhesives are not necessarily thixotropic and therefore, may not give you the tall glob that you desire.  I would be concerned about the potential for silver migration later....
 
On the other hand, there are many non-electically conductive adhesives which are very thixotropic and can very easily give you the large glob which I believe you desire.
 
Both conductive and non-conductives are typically available in a snap cure format, however, the non-conductives will have snap cures most suitable for SMT types of work.  UV cures too.
 
Check out the Ablestiks and Loctites of the world
 
Steven Creswick - Gentex Corporation
Zeeland, MI - USA
-----Original Message-----
From: Kevin Syverson [mailto:[log in to unmask]]
Sent: Friday, April 04, 2003 10:33 AM
To: [log in to unmask]
Subject: [TN] Conductive Epoxy/Adhesive...

Good Morning TechNetters,

 

I am curious if anybody has experience using conductive epoxies/adhesives to prevent movement of heavy surface mount devices during reflow (convection oven, oxygen atmosphere).  We have some heavy double-stacked ceramic capacitors in a 20 pin DIP package (J-lead configuration) that stand off the circuit board approximately 0.125”, which pretty much precludes the possibility of using a standard SMT epoxy for securing the body of the component to the board (at least I think so).  The components have very narrow terminations with much larger (wider and longer) board lands, and the parts are shifting off the pads a bit during reflow.  We are using OA solder paste (Alpha WS609) and I would like to replace the paste on two opposing leads with something to help secure the component during reflow.  Does anybody have any experience or maybe some other ideas for this?

 

Thanks,

 

Kevin Syverson

Silicon Forest Electronics

 

---------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------