If it were incorrect cure/application, and all process parameters were equal during wave solder, then I would expect all boards to exhibit similar conditions????

Also, using that no clean flux...why are they using a saponifer anyway? Especially after sitting for 1 - 2 days with this residue on it???

It has been my understanding that when using a no clean flux, with all process parameters within control, no post cleaning is required...


  ----- Original Message ----- 
  From: Charlie Pitarys 
  To: [log in to unmask] 
  Sent: Wednesday, April 30, 2003 8:49 AM
  Subject: [TN] Intermittent solder mask problems, again.


  Can anyone share process issues with Enthone solder mask? The customer has used my saponifier for just over a year with no issue like this.

  Flux used is Alpha RF800  (foam fluxer) pre-heat at 225 F and solder pot at 490 F  w a conveyor speed of 3 ft / min,

  Saponifier  wash concentration was 10 %, temp at 120F, for 10 mins. Solder mask used is Enthone DSI 41G.

  Please explain on a batch of 50 boards, 5 were perfect, 5 were very bad with

  solder mask peeling, and 40 in the middle with minimal fading.

   All the processes were the same for all, all sat for 1-2 days after wave solder.

  Where the board was masked for secondary attachment ( mask removed prior to clean) and also shadowed by the wave fingers there is no changing of the overall green color. 

  If the wash chemistry is the culprit then it would affect every board and in a uniform fashion. I have photos to share, maybe Steve G.  will let me post them on his sight?

  My suspicions are, incorrect cure, application etc. of the Enthone mask. 

  Thanks in advance. 



  Charlie Pitarys
  Director of Application Technologies
  603.622.2900 X-115
  www.kyzen.com 






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