Message
Yes. BGA and fine pitch work well on flex
assy. In fact the natural flexural properties of the
flex material allow for less stress on the solder joints
due to TCE mismatch, provided you don't introduce a lot of physical 'bending' of
that portion of the flex itself. You can prevent bending of the material
directly beneath these components by having a stiffener laminated into the
substrate.
If
this is a static application of a flex circuit (like interposer layer in a CSP,
or laminated to aluminum for heatsinking & rigidity), that becomes a non
issue. However, if this device is mounted on a dynamic flexing situation,
such as a printer head, you'll definitely need a stiffener, more robust as
package size, number of joints and weight increase. I like placing BGA's
on flex. With a bright light, you can flip it over and kind of 'look up
its skirt' after is soldered on. With good process controls this is a
relatively trouble free application.
Russ
Steiner
TotalEMS LLC
Hello All
Does anyone have experiences on flex
board assembly.Could you please tell me wether fine pitch SMDs and BGA/CSPs to
be mounted on a flex board?
Any words is appreciated.
B.regards
Don
Huawei Manufacturing Technology Center
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