>>>
[log in to unmask] 04/11/03 09:22AM
>>>
Have you tried oblong apertures? As far as I know, studies
made showed
overprint of something like 125 mils didn't cause solder
balls.
-----Original Message-----
From: Tempea, Ioan [
mailto:[log in to unmask]]Sent:
Friday, April 11, 2003 5:22 AM
To:
[log in to unmask]Subject: [TN]
Apertures for intrusive reflow
Hi Technos,
I am
investigating intrusive reflow and big part of the topic is OK for me.
I
learned how to calculate the volume of the paste, I even tried the
process
on several assemblies, all OK.
Now I'm running into a board
with less real estate, so not so much space to
do the overprinting.
According to my calculations the apertures for this
particular TH connector
would overlap. It's a 78.7 mils pitch.
The question is: could I overlap
the apertures and print paste all over,
bridging between the pins? Since we
deal with large pitch and we're talking
liquid paste flowing towards the
holes, would this not create solder bridges
after reflow?
Thanks for
your
insights,
Ioan
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