>>>
[log in to unmask] 04/11/03 09:22AM
>>>
Have you tried oblong apertures? As far as I know, studies made
showed
overprint of something like 125 mils didn't cause solder
balls.
-----Original Message-----
From: Tempea, Ioan [
mailto:[log in to unmask]]Sent:
Friday, April 11, 2003 5:22 AM
To:
[log in to unmask]Subject: [TN] Apertures
for intrusive reflow
Hi Technos,
I am investigating intrusive
reflow and big part of the topic is OK for me.
I learned how to calculate the
volume of the paste, I even tried the process
on several assemblies, all
OK.
Now I'm running into a board with less real estate, so not so much
space to
do the overprinting. According to my calculations the apertures for
this
particular TH connector would overlap. It's a 78.7 mils
pitch.
The question is: could I overlap the apertures and print paste all
over,
bridging between the pins? Since we deal with large pitch and we're
talking
liquid paste flowing towards the holes, would this not create solder
bridges
after reflow?
Thanks for your
insights,
Ioan
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