How about a high MP solder on one pin and a soldering iron? Much easier than having to wait for an adhesive to cure -- and the adhesive may not take nicely to being heated to soldering temp after cure. Brian Kevin Syverson wrote: > Good Morning TechNetters, > > > > I am curious if anybody has experience using conductive > epoxies/adhesives to prevent movement of heavy surface mount devices > during reflow (convection oven, oxygen atmosphere). We have some heavy > double-stacked ceramic capacitors in a 20 pin DIP package (J-lead > configuration) that stand off the circuit board approximately 0.125?, > which pretty much precludes the possibility of using a standard SMT > epoxy for securing the body of the component to the board (at least I > think so). The components have very narrow terminations with much > larger (wider and longer) board lands, and the parts are shifting off > the pads a bit during reflow. We are using OA solder paste (Alpha > WS609) and I would like to replace the paste on two opposing leads with > something to help secure the component during reflow. Does anybody have > any experience or maybe some other ideas for this? > > > > Thanks, > > > > Kevin Syverson > > Silicon Forest Electronics > > > > --------------------------------------------------- > Technet Mail List provided as a free service by IPC using LISTSERV 1.8e > To unsubscribe, send a message to [log in to unmask] with following text > in the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/html/forum.htm for > additional information, or contact Keach Sasamori at [log in to unmask] or > 847-509-9700 ext.5315 > ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------