Siggi,
CEM 1 has a paper core and woven glass surface bonded with an epoxy resin. Not suitable for through hole plating.
I don't know the annual usage but it is still readily available in Europe.
See www.aismalibar.com.    &  www.micam.com
 
FR1 & FR2 are paper based phenolic resin bonded laminates. Not suitable for through hole plating
FR3 is paper based epoxy resin bonded laminates. Not suitable for through hole plating
CEM 3 has a random glass core with woven glass outer layers bonded with epoxy resin. It is suitable for through hole plating.
 
I'll see if I can e-mail a data sheet to you.
 
Hope this helps
Geoff Layhe
-----Original Message-----
From: Zweigart, Siegmund [mailto:[log in to unmask]]
Sent: 10 April 2003 12:42
To: [log in to unmask]
Subject: [TN] CEM-1

Dear all

As I am not that long in the business, if have a lack in knowledge regarding CEM1- PCB materials.

If I remember right (starting as an electronican 24 years ago) CEM is a paper based PCB material single sided without through hole metallization.

In the internet I cannot find any information about CEM1 (maybe there is some from chines companies, but i Cannot read it).

Is this material still used in high volume somewhere (like in cameras...)

I thick it is still used sometimes in consumer products.

What are the recommendations for assembly and reflow process?

Can somebody forward me more information about CEM1 ... CEM3 or FR 1... FR3?

Thanks for your help

Siggi

 
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