All,
Does anyone have
experience working with stacked DRAM?
We have been running
into issues when reworking these part types.
From what I'm told,
there are many types of stacks out there - and my organization is
currently purchasing/building with both value stacks and performance
stacks. The differences between the two types of components lies within
their construction: the performance stacks have a film between the two
components and the value stacks have a small connecting device along the lead
edges, with minimal coating between the two DRAM.
When using our
fairly basic rework equipment (AAT Hot Air Machines, Haako hot air pencil,
Metcal iron), we run into DRAM issues when reworking the value parts - no issues
with the performance. We have already contacted the DRAM manufacturer to
verify whether or not they could recommend rework equipment more suitable to
dealing with these parts... The manufacturer recommended a shovel iron
tip, reflowing one side at a time, until lifted. Well, this works very
well - when one has the real-estate to perform such a repair... but I'm
dealing with minimal part spacing on our PCBs - and using a shovel tip is not
possible.
Any
ideas?