Hello Did you also look into this semi flex material? In this case the flex part is made of thin FR4. It seems to be cheaper than the Polyimide solution and it is not hygroscopic. The material is rated for 5 to 10 bending cycles (should be enough for mounting) Siggi -----Original Message----- From: Roger Stoops [mailto:[log in to unmask]] Sent: Dienstag, 22. April 2003 22:26 To: [log in to unmask] Subject: [TN] Cost Comparison of Flex Circuit Mat'l Dear all, I guess there are two basic types of Cu-clad polyimide: Cu-clad polyimide with adhesive and adhesiveless Cu-clad polyimide. I am curious as to the relative cost of each, and the advantages or limitations of using either one. The end use is Class 2, Type 5A (flex to install), in a (fairly) sealed enclosure that will see temps of -20C to +85C. Only two copper layers, no plated holes. In the past our FPCs have always been of the Cu-adhesive-polyimide type. I want to know if there would be any advantage to using the adhesiveless stuff, besides thinner circuits. Cordially, Roger M. Stoops, CID Trimble Navigation Ltd., Dayton, OH, USA Ph: 937.233.8921 or 937.233.4574 ext 288 Fax: 937.233.7511 --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------