I'm looking for some general inputs on what others are doing with respect to wave soldering SMD's. I have an application that uses some active devices on the solder side. My temptation is to wave solder the parts. The spec for the parts does not call out wave soldering but does say that the terminals of the can be subjected to 250C for 10 sec. Note that it says the terminals can be subjected to this temp. I don't have a problem lowering my solder wave temp from 260C down to 250C but I wonder about the case of the part. The case is a JEDEC DO-214AB, molded plastic over passivated junction. I think that the molded plastic probably indicates that it is not compatible with wavesoldering. The device is a transorb. I know that I posted this question before but, does anyone have success with wave soldering ceramic caps larger than 1812's? All the specs I've looked at talk about not recommending wave soldering due to the steep gradient associated when moving from preheat to the wave itself. Can adjustments to the process overcome this problem? I have some ideas about this but, I'd like to hear what others are doing. We are working to J-Std-001C, class 3. Thanks for your help. Bill Kasprzak Moog Inc. Manufacturing Engineering, Electronics --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------