Hi Technos, I am investigating intrusive reflow and big part of the topic is OK for me. I learned how to calculate the volume of the paste, I even tried the process on several assemblies, all OK. Now I'm running into a board with less real estate, so not so much space to do the overprinting. According to my calculations the apertures for this particular TH connector would overlap. It's a 78.7 mils pitch. The question is: could I overlap the apertures and print paste all over, bridging between the pins? Since we deal with large pitch and we're talking liquid paste flowing towards the holes, would this not create solder bridges after reflow? Thanks for your insights, Ioan --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------